Materials Transactions Online

Materials Transactions, Vol.61 No.10 (2020) pp.1974-1980
© 2020 Journal of Japan Institute of Copper

Heat Transfer Modeling between the Mold and the Ingot for Convex Concave Ingot Surface

Toshio Sakamoto1, Akira Matsushita1, Yasuhiro Oda1, Yuichi Motoyama2, Hitoshi Tokunaga2 and Toshimitsu Okane2

1Central Research Institute, Mitsubishi Materials Co., Kitamoto 364-0028, Japan
2Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8564, Japan

In this paper, a heat transfer model between the mold and the ingot with convex and concave surfaces for continuous casting (CC) process of copper and copper alloys is proposed and discussed. Conventionally, during CC process, vibration of the mold leads to ingot with convex and concave surfaces known as oscillation marks. These marks may cause heat resistance between the mold and the ingot. In the model, three areas where heat resistances occurs were considered: (ΔR1) non-contacting area, (ΔR2) concave area derived from decrease of thermal conductivity, and (ΔR3) area where non-effective heat flow exists in solid phase. The heat resistance values were obtained either analytically or by numerical methods for conditions typically observed in the CC process. Quantitative analyses and comparison of heat resistance values indicated that ΔR3 was the most significant factor and that ΔR1 and ΔR2 was negligible. Furthermore, it was found that slight changes in contact condition results in a large change in heat resistance.


(Received 2020/05/25; Accepted 2020/07/01; Published 2020/09/25)

Keywords: heat transfer model, continuous casting (CC) process, copper and copper alloy, mold, thermal resistance, numerical method

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