Materials Transactions Online

Materials Transactions, Vol.50 No.05 (2009) pp.1231-1234
© 2009 The Japan Institute of Metals

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Jenn-Ming Song1, Yu-Lin Shen1, Chien-Wei Su1, Yi-Shao Lai2 and Ying-Ta Chiu2

1Department of Materials Science and Engineering, National Dong Hwa University, Hailien 974, Taiwan, R.O. China
2Central Labs, Advanced Semiconductor Engineering, Inc., 811 Nantze, Kaohsiung, Taiwan, R.O. China

This study evaluated mechanical behavior of the intermetallic compounds (IMCs) formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the wires of Cu and Ag under different loading rates. Compared to Ag based IMCs, Cu based IMCs were harder and stiffer, but less strain rate sensitive. The morphology of the indent impression was found depending on the ratio of the modulus to hardness, and the crystal structure of the IMCs.

(Received 2009/1/15; Accepted 2009/2/27; Published 2009/4/25)

Keywords: soldering, nanoindentation, intermetallic compounds, strain rate sensitivity exponent (m)

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