Materials Transactions Online

Materials Transactions, Vol.50 No.05 (2009) pp.1135-1138
© 2009 The Japan Institute of Metals

Wettability of Low Silver Content Lead-Free Solder Alloy

I Gusti Bagus Budi Dharma1, Mohd Hamdi Abd Shukor1 and Tadashi Ariga2

1Department of Engineering Design and Manufacture, University of Malaya, Malaysia
2Department of Material Science, School of Engineering, Tokai University, Hiratsuka 259-1292, Japan

Wettability of low silver (Ag) content Sn-xAg-0.7Cu-0.5In lead-free solder (x = 0.1, 0.3, 0.5) on copper substrate was investigated. Wetting balance test results indicated that varying small Ag content in the alloy affects the wettability of solders with higher Ag content showing better wettability. The contact angles of the solder alloy showed dependence on Ag content in solder and temperature. Solder alloy with no Ag content and 0.5 mass% Ag content displayed similar contact angle and qualitatively similar surface tension; however, the maximum wetting force is significantly difference, which indicates difference in the density of solder alloy. Effects of different fluxes on wettability were also studied.

(Received 2009/1/19; Accepted 2009/2/23; Published 2009/4/25)

Keywords: low silver content, wettability, lead-free solder

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