日本金属学会誌

J. Japan Inst. Met. Mater, Vol. 85, No. 07 (2021),
pp. 264-272

Effect of Polymer Additives and Chloride Ions on Electrodeposition Behavior and Morphology of Electrolytic Copper Powder

Kentaro Ochi1,2, Makoto Sekiguchi2, Satoshi Oue3 and Hiroaki Nakano3

1 Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, Fukuoka 819-0395
2 Mitsui Mining & Smelting Co., Ltd., Hiroshima 725-0025
3 Department of Materials Science & Engineering, Faculty of Engineering, Kyushu University, Fukuoka 819-0395

Abstract:

To investigate the effect of polymer additives and chloride ions on the electrodeposition behavior and morphology of copper powder, the polarization curves were measured and constant current electrolysis of 300 A·m−2 and 500 A·m−2 was conducted in an electrolytic solution containing 0.079 mol·dm−3 of Cu2+ and 0.5 mol·dm−3 of free H2SO4 at 293K and 393 K without stirring. Polyethylene glycol (PEG) and polyethyleneimine (PEI) were used as polymer additives. PEG and PEI had a suppressing effect on the electrodeposition of copper powder. The current efficiency for Cu deposition decreased with the addition of PEG and PEI. The addition of PEG decreased the average particle size of the copper powder, while PEI didn’t change the average particle size. When Cl coexisted with PEG, the suppressing effect on the electrodeposition of copper powder became even greater and the particle size of the copper powder became finer than when Cl or PEG was added alone.

[doi:10.2320/jinstmet.J2021018]


(Received 2021/03/25)

Keywords:

electrolytic copper powder, chloride ions, polyethyleneimine, polyethylene glycol, electrodeposition, polarization curve, current efficiency, morphology, charge transfer, diffusion, rate-determining


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