日本金属学会誌

J. Japan Inst. Metals, Vol. 70, No. 7 (2006),
pp. 548-553

Influence of Lattice Defects Introduced in Copper during Electroplating on the Interlayer Reaction to Sn-3.0Ag-0.5Cu Lead Free Solder

Itsuroh Shishido1,, Akihiko Matsuo2,, Hirokazu Toyoyama1, Masataka Mizuno1,3, Hideki Araki1,3 and Yasuharu Shirai1,3

1Department of Materials Science and Engineering, Graduate School of Engineering, Osaka University, Suita 565-0871
2Department of Materials Science and Engineering, Faculty of Engineering, Osaka University, Suita 565-0871
3Center for Atomic and Molecular Technologies, Graduate School of Engineering, Osaka University, Suita 565-0871

Abstract:

The interlayer reaction between Sn-3.0Ag-0.5Cu lead free solder and electrolytic coppers, those include different types of lattice defects analyzed by positron annihilation technique in advance, has been investigated. The copper sample, which has a higher concentration of vacancy clusters, has a higher growth rate of Cu3Sn layer formed on reaction diffusion with the solder, and only for the sample voids was observed in the layer.


(Received 2005/12/13)

Keywords:

lead free, copper, positron annihilation, reaction diffusion, vacancy


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