日本金属学会誌

J. Japan Inst. Metals, Vol. 69, No. 9 (2005),
pp. 825-830

Evaluation of Heat Resistant of Tungsten/Copper Coatings by Use of Plasma Heating

Yoshiyasu Itoh1, Shoko Suyama1, Hideyasu Andoh2 and Takahiko Shindoh1

1Power and Industrial Systems R&D Center, Toshiba Corporation, Yokohama 230-0045
2Power and Industrial Systems R&D Center, Toshiba Corporation, Kawasaki 210-0862

Abstract:

Tungsten/copper coatings had been developed by using a plasma spraying process for the electric arc resistance. However, the heat resistant properties, such as the delamination of tungsten/copper coatings, were not clarified. In this study, a plasma heating apparatus with a cooling function of specimen is newly developed for the evaluation of heat resistant of tungsten/copper coatings, which are sprayed by a low pressure plasma spraying process. As a result, it is verified using the plasma heating apparatus that the delamination lives of tungsten/copper coatings can be evaluated by the thermal cycle test under gradient temperature distribution. Also, it is confirmed by stress analyses that the delamination of tungsten/copper coatings is mainly caused by the stress singularity at the edge of coating interface. Consequently, the reduction of stress singularity at the edge of tungsten/copper coatings is effective for lengthening of the delamination lives.


(Received 2005/5/13)

Keywords:

tungsten/copper coating, plasma heating, heat resistant, low pressure plasma spraying, delamination, thermal cycle, stress singularity


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