日本金属学会誌

J. Japan Inst. Metals, Vol. 68, No. 1 (2004),
pp. 8-13

Analysis of Joining Boundary between Ni--P Electroless Plate and Solder by EPMA Scatter Diagram Method (I)

Takashi Kimura1, Takashi Sugizaki2, Kenji Nishida1, Nobuhiro Ishikawa1 and Shigeo Tanuma1

1Materials Analysis Station, National Institute for Materials Science, Tsukuba 305-0047
2Research and Development Department, Meltex Incorporation, Saitama 331-0811

Abstract:

We have developed scatter diagram method to evaluate material structure from the X-ray image data of electron probe micro analyzer (EPMA). The X-ray image data are projected on the two dimensional space of X-ray intensity to make a histogram so called scatter diagram. The analysis of this scatter diagram gives us important information of the material such as distribution of elements in complex compounds.
We have applied this method for the study of the bonding interface between Ni--P electroless plate and SnPb solder. We have found the coarse δ (Ni3Sn4) phase and mixture fine (Ni3Sn4)x+Pb(1-x) phase at the bonding interface between Ni--P electroless plate and the Sn-Pb solder. The existence P-rich region at the edge of solder side in the Ni--P electroless plate is confirmed.
The analysis of fracture surface revealed that the crack is generated at the interface between P-rich region and δ-phase and proceeds towards the solder.


(Received 2003/10/14)

Keywords:

scatter diagram method, electron probe micro analyzer, X-ray image, Tin and Lead (Sn--Pb) solder, NiSn compound


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