日本金属学会誌

J. Japan Inst. Metals, Vol. 65, No. 10 (2001),
pp. 910-915

Development of a New Composite Plating Method Orienting Dispersed Materials by Use of a High Magnetic Field

Takashi Yamada1 and Shigeo Asai2

1Nagoya Municipal Industrial Research Institute, Nagoya 456-0058
2Graduate School of Engineering, Nagoya University, Nagoya 464-8603

Abstract:

For conventional composite platings, mechanical agitation has been indispensable. In this study, a new method of composite platings has been developed, where a high magnetic field is imposed in the direction parallel to an electrolytic current instead of mechanical agitation. The method provides a micro agitation in the vicinity of a plating surface. It is noticed that the micro agitation aligns particles to the magnetic field direction in a deposited film as well as homogenizing them. The mechanism of aligning particles is discussed, which is based on the generation of microscopic eddy motion around each particle due to the interaction of an imposed magnetic field and an electrolytic current distorted by the existence of non-conducting particles.


(Received May 14, 2001)

Keywords:

composite plating, magnetic effect, high magnetic field, Lorenz force, eddy, particle orientation, alumina particle, Watt's type nickel bath


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