日本金属学会誌

J. Japan Inst. Metals, Vol. 65, No. 10 (2001),
pp. 903-909

Influence of Deposition Conditions on Corrosion Resistance of DLC/Al Prepared by Ionization Deposition

Akemi Tsuchiyama1, Mamoru Minami1, Yukari Shima1,, Yasuyuki Takatani2, Yasunori Hayashi3, Masataka Masuda3 and Hiroki Hasuyama4

1Fukuoka Industrial Technology Center Mechanics & Electronics Institute, Kitakyushu 807-0831
2Hyogo Prefectural Institute of Industrial Research, Kobe 654-0037

3Fuculty of Engineering, Kyushu University, Fukuoka 812-8581

4Kurume Institute of Technology, Kurume 830-0052

Abstract:

The purpose of this study is to improve the corrosion resistance and to examine the electrochemical behavior of Diamond-like carbon (DLC) films. DLC films were prepared by the ionization deposition method with different film thickness, in which benzene (C6H6) was used as precursor gas. The film thickness was changed from 106 to 637 nm and the bias voltage was applied at -1.0 and -2.0 kV. The electrochemical corrosion tests were performed by potentiodynamic anodic polarization, potentiostatic polarization and galvanostatic polarization techniques in 3 mass%NaCl aqueous solutions open to the air at 333 K. The corroded surfaces of DLC/Al after the galvanostatic polarization measurements were observed by a scanning electron microscope. We also examined the adhesion of films using a tensile pull-off tester. In this study, the influence of the preparation conditions on the corrosion resistance of DLC/Al are reported from a study of electrochemical properties. It is found that the corrosion resistance of DLC/Al samples is superior with decreasing film thickness. The corrosion resistance of DLC prepared at Vb=-2.0 kV is more superior to that at Vb=-1.0 kV with similar thickness. The adhesive strength of films is higher for the thinner films and this tendency correlated with the corrosion resistance by electrochemical tests.


(Received May 8, 2001)

Keywords:

diamond-like carbon film coated on aluminum, ionization deposition method, corrosion resistance, negative bias voltage, film thickness, adhesion


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