日本金属学会誌

J. Japan Inst. Metals, Vol. 65, No. 1 (2001),
pp. 64-69

Influence of Small Amounts of Alloying Elements (Sb, Sn, Ti, P, Be) on Recrystallization Behavior of a Cu-2.0 mass%Fe Alloy

Kazuhisa Kita1, Takayuki Kita1,, Kazuo Yamana2, Kazuo Kitagawa1 and Ryoichi Monzen1

1Department of Mechanical Systems Engineering, Faculty of Engineering, Kanazawa University, Kanazawa 920-8667
2Ceramics Sect. of Chemistry and Food Dept., Industrial Research Institute of Ishikawa, Kanazawa 920-0223

Abstract:

The effects of alloying elements (Sb, Sn, Ti, P and Be) in the range of addition up to 0.1 mass% on the recrystallization behavior of a Cu-2.0 mass%Fe alloy have been investigated by means of micro-hardness measurement and metallographic observation. The incubation time for recrystallization and the grain growth rate during recrystallization depend strongly on the content of each element. The grain formation and growth are accelerated by the addition of P and are suppressed by the addition of Sb, Sn, Ti and Be. A 0.05 mass%Be-added alloy recrystallizes least easily. Most recrystallization nuclei in Ti- and P-added alloys form at Fe2Ti and Fe3P particles larger than about 1.0 μm. For the alloys with Sb, Sn and Be, the nucleation of recrystallization takes place predominantly at α-Fe particles, larger than 0.3 μm, on grain boundaries. A good correlation is found between the time for recrystallization and the size of the Fe2Ti particles, Fe3P particles and α-Fe boundary particles. The larger the particle size, the more easily the nucleation of recrystallization occurs. Adding the solute elements affects the dispersion of α-Fe in-grain particles which retards grain-boundary migration and thus may control the grain growth.


(Received August 11, 2000)

Keywords:

copper-iron, alloying element addition, α-iron boundary particles, α-iron in-grain particles, Fe2Ti particles, Fe3P particles, recrystallization, nucleation and growth


PDF(Free)PDF (Free)     Table of ContentsTable of Contents

Please do not copy without permission.