Hiromi Miura, Kazuhide Saijo and Taku Sakai
Department of Mechanical and Control Engineering, The University of Electro-Communications, Chofu, Tokyo
Cu-SiO2 bicrystals having  twist boundaries with different misorientation angles were tensile tested at various temperatures from 473 to 1173 K. Most bicrystals fractured intergranularly. As the grain-boundary energy increases, intergranular brittle fracture tended to take place more easily at lower temperatures and the ductility of bicrystals with higher energy boundaries became lower. The elongation to fracture of the fractured bicrystals intergranularly decreased with increase in temperature monotonically. These grain boundary dependent characteristics of deformation and fracture behavior of bicrystals could be explained reasonably by considering the difference in the occurrence of grain-boundary sliding and Schmid factor.
(Received May 9, 1995)
Cu-SiO2 bicrystal, high-temperature deformation, grain-boundary fracture, grain-boundary energy,  twist boundary
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