日本金属学会誌

J. Japan Inst. Metals, Vol. 54, No. 12 (1990),
pp. 1401-1407

Wettability of Hot-pressed SiC by Liquid Cu-Ti Alloy

Kiyoshi Nogi1, Koji Ikeda2 and Kazumi Ogino1

1Department of Materials Science and Processing, Faculty of Engineering, Osaka University, Suita
2Graduate Student, Osaka University. Present address: Kawasaki Steel Co. Ltd., Kurashiki

Abstract:

The wettability of hot-pressed SiC, which had been made in present work, by liquid Cu-Ti alloy was investigated at 1393 K under reduced pressure.
The main results are summerized as follows:
(1) The wettability of SiC by liquid Cu-Ti alloy was improved by a small amount of Ti.
(2) A formation of TiC was observed at the initial interface between liquid Cu-Ti alloy and SiC.
(3) The improvement of the wettability was not attained by the formation of TiC but by the dissolu- tion of Si and C into liquid Cu.


(Received 1989/9/18)

Keywords:

sintering, SiC, wettability, copper-titanium alloy, contact angle


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