Kiyoshi Nogi1, Koji Ikeda2 and Kazumi Ogino1
1Department of Materials Science and Processing, Faculty of Engineering, Osaka University, Suita
The wettability of hot-pressed SiC, which had been made in present work, by liquid Cu-Ti alloy was investigated at 1393 K under reduced pressure.
The main results are summerized as follows:
(1) The wettability of SiC by liquid Cu-Ti alloy was improved by a small amount of Ti.
(2) A formation of TiC was observed at the initial interface between liquid Cu-Ti alloy and SiC.
(3) The improvement of the wettability was not attained by the formation of TiC but by the dissolu- tion of Si and C into liquid Cu.
sintering, SiC, wettability, copper-titanium alloy, contact angle
Please do not copy without permission.