日本金属学会誌

J. Japan Inst. Metals, Vol. 41, No. 11 (1977),
pp. 1202-1206

The Stress Reduction of Straining Copper Single Crystal due to Anodic Dissolution

Susumu Sato1, Sh\=oju Masaki2 and Shiro Haruyama3

1Faculty of Engineering, Tokyo Institute of Technology, Tokyo. Present address: Nippon Kokan Co., Ltd., Kawasaki
2Faculty of Engineering, Tokyo Institute of Technology, Tokyo. Present address: Ishikawajima-Harima Heavy Industries Co., Ltd., Tokyo
3Faculty of Engineering, Tokyo Institute of Technology, Tokyo

Abstract:

The stress of a straining copper single crystal in an acidic sulphate solution was found to be reduced by the application of anodic current and to be restored by the cessation of the current. A similar effect was observed by I.R.Kramer on straining single crystals and attributed to the removal of the high dislocation density layer (debris layer) which was formed on the surface as a result of plastic deformation. The stress reduction due to anodic current increased with decreasing strain rate and was greatly exaggerated under the cessation of straining. It was also observed that the magnitude of the stress reduction was proportional to the square of current density and decreased by stirring of solution. Furthermore, the stress reduction effect was also observed by the application of cathodic current. The present results strongly indicate that the stress reduction of straining metal due to anodic dissolution is attributed to the thermal expansion of the specimen by Joul's heat evolved at the specimen/solution interface.


(Received 1977/06/17)

Keywords:


PDF(Free)PDF (Free)     Table of ContentsTable of Contents

Please do not copy without permission.