日本金属学会誌

J. Japan Inst. Metals, Vol. 41, No. 9 (1977),
pp. 904-911

Study on Liquid Phase Bonding of Stainless Steel with Ni-P Plating

Ichiro Kawakatsu1 and Seiji Kitayama1

1College of Science and Engineering, Aoyama Gakuin University, Tokyo

Abstract:

For the diffusion bonding of stainless steel used with Ni-P plating in place of insert metal, the weldability and the relation between bonding processes and bonding strength for various bonding times have been investigated. The results obtained are as follows:
(1) Bonding processes are classified into two stages according to the microstructure. The first stage depends on the decreasing phenomena of Ni-Ni3P eutectic structure and the formation of an intermetallic compound at the bonded zone. On the second stage, intermetallic compound can be seen and chemical composition in the bonded zone is homogenized gradually.
(2) Weldability of bonded joints between similar metals at 880°C is not so good, but the bonding strength increased with bonding time gradually.
(3) In the case of SUS 304-DCuP 1 joints and SUS 430-DCuP 1 joints, their weldabilities are better than those of SUS 304 and SUS 430 joints. The bonding strength of SUS 304-DCuP 1 joints bonded at 900°C for 30 min is 23∼25 kg/mm2 and that of SUS 430-DCuP 1 joints bonded at 900°C for 30 min is 18∼20 kg/mm2.
(4) In the case of SUS 430 joints, the diffusion phenomenon of phosphorus into the base metal was observed and many intermetallic compounds were formed in the bonded zone. The bonding strength in this case is weaker than that of SUS 304 joints.


(Received 1977/02/7)

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