日本金属学会誌

J. Japan Inst. Metals, Vol. 40, No. 11 (1976),
pp. 1122-1130

Surface Impurities of Gold and Copper Prepared by Various Surface Treatments and Adhesion

Koichi Fujiwara1

1Ibaraki Electrical Communication Laboratory, Nippon Telegraph and Telephone Public Corporation, Tokai, Ibaraki

Abstract:

The objective of this paper is to determine the influence of surface impurities caused by various surface treatment on the adhesion of gold and copper whose force was measured by the twist compression bonding method. As a result of analyses of various surfaces using IMA, ESCA, XMA and SEM, it was found that the surface impurities were intimately related to surface treatments and clean surfaces could be obtained by diamond bite cutting, chemical polishing and steel filing. The adhesion of metals depended upon surface treatments and was markedly reduced by abrasive paper finishing. Among the surface contaminations silicon oxides remarkably reduced the adhesion. It was also observed that the adhesion force of metals without contamination was decreased by the repetition of contacts and the number of revolutions.


(Received 1975/12/25)

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