日本金属学会誌

J. Japan Inst. Metals, Vol. 39, No. 3 (1975),
pp. 285-292

An X-ray Study on the Aging Process of a Cu-4%Ti Alloy

Tokuzou Tsujimoto1

1National Research Institute for Metals, Tokyo

Abstract:

The aging process in a Cu-4%Ti alloy during aging at 300 ∼ 600°C has been studied by means of X-ray small-angle scattering (SAS) and X-ray side-bands.
By the analysis of the SAS data, the aging process was subdivided into the four stages I ∼ IV: In stages I and II, the integrated intensity Q0 and Guinier's radius of gyration Rg increased with aging time. For stage II the rates of increase in Q0 and Rg became larger than those observed for stage I. In stage III Q0 remained constant, but for stage IV it decreased with an increase in aging time. At aging temperatures above 400°C, stage I was not observed.
The corresponding behaviour of the main diffraction lines was as follows: In stage I the main diffraction lines did not move at all but in stage II they moved to a high angle side during aging. In stage III, they disappeared or coincided with the diffraction lines of the α2 phase.
Models of the concentration variation in the above-mentioned stages are discussed. The relationship between the stage I--II transition and the interdiffusion coefficient is described.


(Received 1974/09/4)

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