Yutaka Ogawa1 and Eihachiro Tanaka2
1Student of Graduate School, Tohoku University, Sendai; now, Japan Atomic Energy Research Institute, Tokai
The microstructure of 99.99% silver compressed between room temperature and 800°C has been studied. The mean strain rate was 0.1∼20%/min. By using the high temperature microscope which was specially designed for the present purpose, the microstructure was observed during hot compression. The results obtained are as follows: Thermal etching of grain boundary took a long time, but when stress was applied to the specimen, grain boundary could be observed within about 1 sec. Above 400°C, grain boundary migration and sliding were observed, but recrystallized small grains were not observed. After compression above 500°C, grains were larger than before compression and they became larger with increase in compression temperature. Grain boundary migrated faster with increase in strain rate.
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