Materials Transactions Online

Materials Transactions, Vol.57 No.6 (2016)

759-759 :
PREFACE
Yu Shiratsuchi and Koki Takanashi
760-766 :
Finely Controlled Approaches to Formation of Heusler-Alloy/Semiconductor Heterostructures for Spintronics
Kohei Hamaya, Makoto Kawano, Yuichi Fujita, Soichiro Oki and Shinya Yamada
767-772 :
Spin Injection, Transport, and Detection in a Lateral Spin Transport Devices with Co2FeAl0.5Si0.5/n-GaAs, Co2FeSi/MgO/n-Si, and CoFe/MgO/n-Si Junctions
Nobuki Tezuka and Yoshiaki Saito
773-776 :
Interface Magnetic Anisotropy of Pd/Co2FexMn1−xSi/MgO Layered Structures
Takahide Kubota, Tomonari Kamada, Jinhyeok Kim, Arata Tsukamoto, Shigeki Takahashi, Yoshiaki Sonobe and Koki Takanashi
777-780 :
Magnetic Properties of Spinel Ferrite Thin Films Grown by Reactive Sputtering
Hideto Yanagihara, Sonia Sharmin, Tomohiko Niizeki and Eiji Kita
781-788 :
Perpendicular Exchange Bias and Magneto-Electric Control Using Cr2O3(0001) Thin Film
Yu Shiratsuchi and Ryoichi Nakatani
789-795 :
Anomalous Hall Effect Measurement on Nanostructure with Magnetic Pulse Fields
Nobuaki Kikuchi, Satoshi Okamoto and Osamu Kitakami
796-796 :
PREFACE
Yoshiharu Kariya and Ikuo Shohji
797-804 :
Molten Lead-Free Solder Deposited by Inkjet Printing for Bonding of Thin-Film Solar Cell Modules
Chien-Hsun Wang, Weng-Sing Hwang, Wen-Ming Chen, Ho-Lin Tsai and Cheng-Han Wu
805-809 :
Thermal Fatigue Life Evaluation of Epoxy Resin/Si Joint under Mineral Oil Condition
Hideto Takahashi and Yoshiharu Kariya
810-814 :
Effect of Interfacial Hardness on Failure Modes of Liquid Phase Diffusion Bonded Sn/Sn with Bi Filler
Shinji Koyama, Issei Oya and Ikuo Shohji
815-818 :
In Situ Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method
Yumi Hayashi, Hiroshi Miyazawa, Kohei Minamitani and Ikuo Shohji
819-823 :
Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes
Yuichi Yanaka, Yoshiharu Kariya, Hirohiko Watanabe and Hiroaki Hokazono
824-832 :
Application of Spark Sintering to Preparation of Zn-50Sn-Al2O3/Cu Joints for AC-Low Voltage Fuse Elements Without Lead
Kazuhiro Matsugi, Hiromu Matsumoto, Zhe-Feng Xu, Yong-Bum Choi, Ken-ichiro Suetsugu and Koji Fujii
833-837 :
Microstructure and Shear Strength of Low-Silver SAC/Cu Solder Joints during Aging
Hu Luo, Gui-sheng Gan, Yunfei Du, Donghua Yang, Huaishan Wang and Guoqi Meng
838-845 :
Observation on Isothermal Reactive Diffusion between Solid Ni and Liquid Sn
Akihiro Nakane, Takao Suzuki, Minho O and Masanori Kajihara
846-852 :
Effect of Zinc Addition on Void Formation in Solid-Liquid Interdiffusion Bonding of Copper
S. Fukumoto, T. Miyazaki, M. Matsushima and K. Fujimoto
853-859 :
Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy
Maiko Taniguchi and Yoshiharu Kariya
860-864 :
Reliable Material Properties of Aluminum Pads with Strong Delamination Toughness in Gold - Aluminum Wire Bonding
Toru Ikeda and Kenta Shiba
865-872 :
Evolution of Electrical Conductivity in Silver-Loaded Electrically Conductive Adhesives Composed of an Amine-Cured Epoxy-Based Binder
Yoshiaki Sakaniwa, Yasunori Tada and Masahiro Inoue
873-880 :
Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder
Zhang Haidong, Ikuo Shohji, Masayoshi Shimoda and Hirohiko Watanabe
881-886 :
Effects of Metal Surface Conditions on Interfacial Characteristics between Metal and Epoxy Resin
Michiya Matsushima, Yuta Kato, Yusuke Takechi, Shinji Fukumoto and Kozo Fujimoto
887-891 :
Interfacial Reactions in Sn-57Bi-1Ag Solder Joints with Cu and Au Metallization
Hanae Hata, Yuuki Maruya and Ikuo Shohji
892-897 :
Magneto-Optical Enhancement and Chemical Sensing Applications of Perpendicular Magnetic CoPt/Ag Stacked Structures with a ZnO Intermediate Layer
H. Yamane, K. Takeda and M. Kobayashi
898-902 :
Magnetically Retarded Recovery and Recrystallization in Cold Rolled Pure Copper
He Tong, Zhang Guojin, Jia Nan and Zhao Xiang
903-906 :
Electric Evolution in Sputter-Deposited SncSnSi1−cSn Alloy Films
Kenji Sumiyama, Yuichiro Kurokawa, Hirotaka Yamada, Minoru Yamazaki and Takehiko Hihara
907-912 :
Electric and Magnetic Evolution in Sputter-Deposited FexSi1−x Alloy Films
Kenji Sumiyama, Minoru Yamazaki, Takeshi Yoneyama, Kohdai Suzuki, Kohji Takemura, Yuichiro Kurokawa and Takehiko Hihara
913-917 :
Effects of Cerium Addition on the Microstructure, Mechanical Property and Creep Behavior of AM60B Magnesium Alloy
Xiaodong Sun, Wenyun Wu, Donghong Wang, Peiran Deng and Heping Lv
918-921 :
Three-Dimensional Imaging of a Long-Period Stacking Ordered Phase in Mg97Zn1Gd2 Using High-Voltage Electron Microscopy
Kazuhisa Sato, Shunya Tashiro, Yohei Yamaguchi, Takanori Kiguchi, Toyohiko J. Konno, Tomokazu Yamamoto, Kazuhiro Yasuda and Syo Matsumura
922-926 :
Simulation of the Si Precipitation Process in Mg2Si Using a Phase-Field Kinetic Model
Bin Liu, Teruyuki Ikeda and Yasushi Sasajima
927-934 :
Grain Refinement and Ductility Improvement by Hot Extrusion Using a Heteromorphic Die with Small Holes
Kaho Tomita, Toko Tokunaga, Munekazu Ohno and Kiyotaka Matsuura
935-942 :
Effect of Hydrothermal Treatment Coupled with Mechanical Compression on Equilibrium Water Content of Loy Yang Lignite and Mechanism
Xiangchun Liu, Tsuyoshi Hirajima, Moriyasu Nonaka and Keiko Sasaki
943-948 :
Effects of Homogeneous Low Energy Electron Beam Irradiation (HLEBI) on Adhesive Energy of Peeling Resistance of Laminated Sheet with Polyurethane (PU) and Polyethylene Terephthalate (PET)
Sagiri Takase, Chisato Kubo, Masae Kanda, Yoshihito Matsumura and Yoshitake Nishi
949-958 :
Detection and Thickness Estimation of Water Layer in Layered Medium Based on Multi-Reflection of Oblique Incident Ultrasonic Wave
Yang Shen and Sohichi Hirose
959-965 :
Effect of Mn Addition on the Age-Hardening Behavior of an Al-(9-10)%Si-0.3%Mg Die Casting Alloy in T5 and T6 Heat Treatment
Keita Fukasawa, Ryousuke Mohri, Tetsuo Ohtake, Tatsuya Inoue, Akihiro Kuroda, Hiroshi Kambe and Makoto Yoshida
966-972 :
Effect of Shot Peening on Bending Strength of Magnesium Pipe
Yasunori Harada, Izumi Fukuda and Atsushi Yamamoto
973-977 :
Joining of Copper Plates by Unusual Wetting with Liquid Tin and Tin-Lead Solder on “Surface Fine Crevice Structure”
Masashi Nakamoto, Atsushi Fukuda, Jenna Pinkham, Siboniso Vilakazi, Hiroki Goto, Ryo Matsumoto, Hiroshi Utsunomiya and Toshihiro Tanaka
978-982 :
Effect of Excess Energy on Supersaturated Fe-IIIB Thin Films Formation by Ion Plating
Akitaka Sakai, Chonlawich Niyomwaitaya, Takaaki Iijima, Akira Tonegawa and Yoshihito Matsumura
983-987 :
Aluminium-Silicon-Magnesium Filler Metal for Aluminium Vacuum Brazing Wettability and Characteristics of Brazing Microstructure
Tuoyu Yang, Deku Zhang, Kehong Wang and Jun Huang
988-994 :
A Feasibility Study on the Three-Dimensional Friction Stir Welding of Aluminum 5083-O Thin Plate
Young-Gon Kim, In-Ju Kim, Young-Pyo Kim and Sung-Min Joo
995-1000 :
A Novel Method of Antibacterial Evaluation Based on the Inhibition of Hydrogen Sulfide Producing Activities of Salmonella
Yutaka Midorikawa, Masaaki Nakai, Kaoru Midorikawa and Mitsuo Niinomi
1001-1005 :
Constituent Element Addition to n-Type Bi2Te2.67Se0.33 Thermoelectric Semiconductor without Harmful Dopants by Mechanical Alloying
Kazuhiro Hasezaki, Sena Wakazuki, Takuya Fujii and Masato Kitamura
1006-1009 :
A Method for Studying the Nano-Scale Stress-Strain Response of a Material by Nanoindentation
Naoki Fujisawa, Tomo Ogura and Akio Hirose
1010-1013 :
Measurement of Thermal Expansion Coefficient of 18R-Synchronized Long-Period Stacking Ordered Magnesium Alloy
Nobuhiro Yasuda and Shigeru Kimura
1014-1016 :
Foaming Behavior of Aluminum Foam Precursor Using Only Friction Heat of Rotating Tool
Yoshihiko Hangai, Tomoaki Morita and Takao Utsunomiya

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