Materials Transactions, Vol.51 No.12 (2010) pp.2329-2331
© 2010 The Japan Institute of Metals

Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

Byung-Seung Yim and Jong-Min Kim

A new class of isotropic conductive adhesive (ICA) using a carbon nanotubes (CNTs) and a low-melting-point alloy (LMPA) fillers has been developed. We investigated the fundamental materials characteristics including curing behavior and temperature-dependant viscous property of ICA. In addition, the morphology of conduction paths in each ICA was investigated using X-ray inspection systems and an optical microscope. Mechanical and electrical characteristics of formulated ICAs were determined and compared with those of three kinds of conventional ICAs filled with Ag flakes. The CNT-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. In addition, the results indicated that the CNT-filled ICA exhibit lower electrical resistance and higher mechanical strength, as compared with those of conventional ICAs.

(Received 2010/9/6; Accepted 2010/10/6; Published 2010/11/17)

Keywords: carbon nanotuubes (CNTs), isotropically conductive adhesive (ICA), low-melting-poing alloy, polymeric composites

PDF (Free)

Table of Contents

REFERENCES

1. M. J. Yim, Y. Li, K. S. Moon, K. W. Paik and C. P. Wong: J. Adhesion Sci. Technol. 22 (2008) 1593–1630.
2. L. J. Matienzo, R. N. Das and F. D. Egitto: J. Adhesion Sci. Technol. 22 (2008) 853–869.
3. I. Mir and D. Kumar: Int. J. Adhesion Adhesive 28 (2008) 362–371.
4. D. D. Lu and C. P. Wong: J. Adhesion Sci. Technol. 22 (2008) 835–851.
5. H. K. Kim and F. G. Shi: Microelectron. J. 32 (2001) 315–321.
6. M. J. Yim and K. W. Paik: Int. J. Adhesion Adhesive 26 (2006) 304–313.
7. Q. K. Tong, D. L. Markley, G. Frederickson, R. Kuder and D. Lu: Proc. 49th Electronic Components and Technology Conference 49 (1999) pp.347–352.
8. Y. S. Eom, J. W. Baek, J. T. Moon, J. D. Nam and J. M. Kim: Microelec. Eng. 85 (2008) 327–331.
9. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaudhuri, R. Harmansen, S. Lau and D. Napp: IEEE Trans. Comp. Packag. Manufac. Technol. Part C 19 (1996) 241–250.
10. J. Kim, W. J. Koros and D. R. Paul: Polymer 47 (2006) 3104–3111.
11. J. M. Kim, K. Yasuda, M. Yasuda and K. Fujimoto: Mater. Trans. 45 (2004) 793–798.
12. B. S. Yim, J. M. Kim, S. H. Jeon, S. H. Lee, J. H. Kim, J. G. Han and M. H. Cho: Mater. Trans. 50 (2009) 2649–2655.

© 2010 The Japan Institute of Metals
Comments to us : editjt@jim.or.jp