Materials Transactions, Vol.50 No.01 (2009) pp.226-228
© 2009 The Japan Institute of Metals

Direct Bonding to Aluminum with Silver-Oxide Microparticles

Toshiaki Morita¹, Yusuke Yasuda¹, Eiichi Ide¹ and Akio Hirose²

This study demonstrated that direct bonding between electrode and aluminum by using silver oxide particles which added acetic acid silver, followed by heating in air at 350°C under a pressure of 2.5 MPa. Direct bonding with aluminum by using solder materials containing tin, lead, or the like has been impossible in the past. We think this technique creates strong bonding between silver and the natural oxide film formed on an aluminum surface by the combustion heat generated during oxidation of acetic acid (which is generated by decomposition of the silver acetate as it is heated).

(Received 2008/8/18; Accepted 2008/10/27; Published 2008/12/10)

Keywords: silver oxide, reduction, bonding technique, aluminum

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REFERENCES

1. T. Morita, Y. Yasuda, E. Ide, Y. Akada and A. Hirose: Mater. Trans. 49 (2008) 2875–2880.
2. A. Hirose, E. Ide and K. F. Kobayashi: Jpn. Inst. Electron. Packag. 7 (2004) 511–515.
3. E. Ide, S. Angata, A. Hirose and K. F. Kobayashi: Acta Mater. 53 (2005) 2385–2393.
4. E. Ide, A. Hirose and K. F. Kobayashi: Mater. Trans. 47 (2006) 211–217.
5. T. Morita, E. Ide, Y. Yasuda, A. Hirose and K. Kobayashi: Jpn. J. Appl. Phys. 47 (2008) 6615–6622.
6. Y. Akada, H. Tatsumi, T. Yamaguchi, A. Hirose, T. Morita and E. Ide: Mater. Trans. 49 (2008) 1537–1545.
7. Y. Yasuda, T. Morita, E. Ide, H. Hozoji and T. Ishii: Japan Patent 178911 (2008).

© 2009 The Japan Institute of Metals
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