Materials Transactions Online

Materials Transactions, Vol.48 No.10 (2007) pp.2795-2798
© 2007 The Japan Institute of Metals

SEM In Situ Study on Deformation Behavior of Cu and Cu/Ni Films under Three-Point Bending

Jianguo Huang1, Xishu Wang2 and Xiangkang Meng1

1National Laboratory of Solid State Microstructures, Department of Materials Science and Engineering, Nanjing University, Nanjing 210093, P. R. China
2Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China

The deformation and failure of Cu and Cu/Ni film/substrate structure were studied by the scanning electron microscope (SEM) in situ observation under three-point bending. It was found that the rapid deformation occurred at sites near to the interface of film/substrate in Cu and Cu/Ni films. The transferring of deformation finally caused the surface wrinkle. The wrinkle stress can be expressed as σwf = k(EfEs2)1/3. Based on the results in mesoscale, a simple failure mechanism of films/substrate structure is suggested to understand the transferring process of deformation and failure characteristics.

(Received 2007/3/15; Accepted 2007/8/8; Published 2007/9/12)

Keywords: metallic films, failure mechanism, in situ observation, three-point bending

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