Vol.46 No.11

Materials Transactions, Vol.46 No.11 (2005)

2299-2299 :: PREFACE
Katsuaki Suganuma
2300-2308 :: Mechanism and Prevention of Spontaneous Tin Whisker Growth
King-Ning Tu, Jong-ook Suh, Albert Tzu-Chia Wu, Nobumichi Tamura and Chih-Hang Tung
2309-2315 :: Isothermal Fatigue Properties of Sn--Ag--Cu Alloy Evaluated by Micro Size Specimen
Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga and Masahisa Otsuka
2316-2321 :: Fatigue Reliability Evaluation for Sn--Zn--Bi and Sn--Zn Lead-Free Solder Joints
Qiang Yu, Jae-Chul Jin, Do-Seop Kim and Masaki Shiratori
2322-2328 :: Reliability of Sn--8 mass%Zn--3 mass%Bi Lead-Free Solder and Zn Behavior
Sun-Yun Cho, Young-Woo Lee, Kyoo-Seok Kim, Young-Jun Moon, Ji-Won. Lee, Hyun-Joo Han, Mi-Jin Kim and Jae-Pil Jung
2329-2334 :: Estimation of Thermal Fatigue Resistances of Sn--Ag and Sn--Ag--Cu Lead-Free Solders Using Strain Rate Sensitivity Index
Ikuo Shohji, Kiyokazu Yasuda and Tadashi Takemoto
2335-2343 :: Fatigue Damage Evaluation by Surface Feature for Sn--3.5Ag and Sn--0.7Cu Solders
Takehiko Takahashi, Susumu Hioki, Ikuo Shohji and Osamu Kamiya
2344-2350 :: Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders
Joo Won Lee, Zin Hyoung Lee and Hyuck Mo Lee
2351-2358 :: IMC Growth of Solid State Reaction between Ni UBM and Sn--3Ag--0.5Cu and Sn--3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
Shinji Ishikawa, Eiji Hashino, Taro Kono and Kohei Tatsumi
2359-2365 :: Flip Chip Bump Formation of Sn--1.8Bi--0.8Cu--0.6In Solder by Stencil Printing
Jaesik Lee, Jae-Pil Jung, Chu-Seon Cheon, Yunhong Zhou and Michael Mayer
2366-2371 :: Microstructure and Mechanical Properties of Sn--0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method
Dae-Gon Kim and Seung-Boo Jung
2372-2379 :: Shear Fracture Behavior on Ball Grid Arrayed Tin--Silver--Copper Solder/Pure Copper Pad Joint Interface
Kunihiro Noguchi, Yu‾ya Endou, Isao Shimizu and Yasuhide Ohno
2380-2385 :: Joints Soldered on Electroless Ni--Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement
Seishi Kumamoto, Hitoshi Sakurai, Kazuki Ikeda and Katsuaki Suganuma
2386-2393 :: Interfacial Reaction and Mechanical Characterization of Eutectic Sn--Zn/ENIG Solder Joints during Reflow and Aging
Jeong-Won Yoon, Hyun-Suk Chun and Seung-Boo Jung
2394-2399 :: Interfacial Reaction between Sn--Ag--Co Solder and Metals
Hiroshi Nishikawa, Akira Komatsu and Tadashi Takemoto
2400-2405 :: Microstructural Evolution of Joint Interface between Eutectic 80Au--20Sn Solder and UBM
Sung Soo Kim, Jong Hoon Kim, Seong Woon Booh, Tae-Gyu Kim and Hyuck Mo Lee
2406-2412 :: Reactivity between Sn--Ag Solder and Au/Ni--Co Plating to Form Intermetallic Phases
Takashi Yamamoto, Shigeaki Sakatani, Shinji Kobayashi, Keisuke Uenishi, Kojiro F. Kobayashi, Masaaki Ishio, Kazuhiro Shiomi, Akio Hashimoto and Masaharu Yamamoto
2413-2418 :: Interfacial Properties of Zn--Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate
Jae-Ean Lee, Keun-Soo Kim, Katsuaki Suganuma, Junichi Takenaka and Koichi Hagio
2419-2425 :: Microstructure Control in Sn--0.7 mass%Cu Alloys
Kazuhiro Nogita, Jonathan Read, Tetsuro Nishimura, Keith Sweatman, Shoichi Suenaga and Arne K. Dahle
2426-2430 :: Isoplethal Sections of the Liquidus Projection and the 250°C Phase Equilibria of the Sn--Ag--Cu--Ni Quaternary System at the Sn-Rich Corner
Chen-nan Chiu, Yu-chih Huang, An-ren Zi and Sinn-wen Chen
2431-2436 :: Study on Sn--Ag Oxidation and Feasibility of Room Temperature Bonding of Sn--Ag--Cu Solder
Ying-Hui Wang, Matiar R Howlader, Kenji Nishida, Takashi Kimura and Tadatomo Suga
2437-2442 :: Identification of β Phase Particles in an Isothermally Aged Al--10 mass%Mg--0.5 mass%Ag Alloy
Masahiro Kubota
2443-2448 :: Development of Observation Method for Tempered Martensite Microstructure Using Chemical Mechanical Polishing Technique
Masao Hayakawa, Saburo Matsuoka, Yoshiyuki Furuya and Yoshinori Ono
2449-2453 :: Grain Refinements of Al--Mg Alloy by Hydrogen Heat-Treatments
Atsunori Kamegawa, Takao Funayama, Junya Takahashi, Hitoshi Takamura and Masuo Okada
2454-2460 :: Ferrite Grain Size Formed by Large Strain-High Z Deformation in a 0.15C Steel
S. V. S. Narayana Murty, Shiro Torizuka and Kotobu Nagai
2461-2466 :: Empirical Equations for Bubble Formation Frequency from Downward-Facing Nozzle with and without Rotating Flow Effects
Tomoya Goda, Manabu Iguchi, Yasushi Sasaki and Hiromichi Kiuchi
2467-2472 :: The Dependence of Coating Characteristics on Progress Parameters and Alloy Compositions
Olga. P. Terleeva, Young-Joo Oh, Myoung-Ryul Ok, Vladimir V. Utkin, Heon-Phil Ha and Dong-Heon Lee
2473-2477 :: Residual Stress Distribution in Thermally Sprayed Self-Fluxing Alloy Coatings
Fumitaka Otsubo, Katsuhiko Kishitake and Toshio Terasaki
2478-2483 :: Influence of Heat Treatment on the Distribution of Ni₂Nb and Microsegregation in Cast Inconel 718 Alloy
Nader El-Bagoury, Toru Matsuba, Kaoru Yamamoto, Hirofumi Miyahara and Keisaku Ogi
2484-2489 :: Tensile Properties of Diffusion Bonds between TiAl Intermetallic Compound and Titanium Alloy
Satoru Kanai, Sachio Seto and Hiroyuki Sugiura
2490-2496 :: AE Source and Relation between AE Activity and Rate of Corrosion of Oil Tank Bottom Plate on Acidic Soils
Sosoon Park, Shigeo Kitsukawa, Kenji Katoh, Sigenori Yuyama, Hiroaki Maruyama and Kazuyoshi Sekine
2497-2503 :: Fabrication of Cemented Carbide Molds with Internal Cooling Channels Using Hybrid Process of Powder Layer Compaction and Milling
Yoshiaki Mizukami and Kozo Osakada
2504-2508 :: Preparation of TiB₂--SiC Eutectic Composite by an Arc-Melted Method and Its Characterization
Wen-Jun Li, Rong Tu and Takashi Goto
2509-2513 :: Nanosize Particles of ZrVFe Alloy by Pulsed Laser Ablation in Ethanol
Daesup Kil, Yongjae Suh, Heedong Jang, Jaechen Lee, Changbin Song and Wonbaek Kim
2514-2517 :: Orientation of Hydroxyapatite C-Axis under High Magnetic Field with Mold Rotation and Subsequent Sintering Process
Jun Akiyama, Masami Hashimoto, Hiroaki Takadama, Fukue Nagata, Yoshiyuki Yokogawa, Kensuke Sassa, Kazuhiko Iwai and Shigeo Asai
2518-2524 :: Bi₂Te₃-Related Thermoelectric Samples with Aligned-Texture Prepared by Plastic Deformation
Yoshinori Morisaki, Hiroshi Araki, Hiroyuki Kitagawa, Masaki Orihashi, Kazuhiro Hasezaki and Keiichi Kimura
2525-2529 :: Microstructure and Thermoelectric Properties of Hot-Pressed n-Type Bi_1.9Sb_0.1Te_2.6Se_0.4 Alloys Prepared Using a Rapid Solidification Technique
Yuma Horio, Hiroyuki Yamashita and Takahiro Hayashi
2530-2535 :: Effects of Substrate Temperature and Oxygen Pressure on Crystallographic Orientations of Sputtered Nickel Oxide Films
Hao-Long Chen, Yang-Ming Lu, Jun-Yi Wu and Weng-Sing Hwang
2536-2540 :: Ag--Ti Alloy Used in ITO--Metal--ITO Transparency Conductive Thin Film with Good Durability against Moisture
Shi-Wei Chen, Chun-Hao Koo, Hsin-Erh Huang and Chia-Hua Chen
2541-2544 :: Ce--Cu--Fe--Al--Si Bulk Metallic Glass Alloys With High Glass Forming Ability
Zan Bian and Akihisa Inoue
2545-2547 :: A Bulk Glassy Cu--Zr--Ti--Sn Alloy with Superior Plasticity
Hua Men and Tao Zhang

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