Materials Transactions Online

Materials Transactions, Vol.45 No.3 (2004)

606-613 :
Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface
Tao-Chih Chang, Min-Hsiung Hon and Moo-Chin Wang
614-624 :
Thermodynamic Study of Phase Equilibria in the Sn-Ag-Bi-Zn Quaternary System
Hiroshi Ohtani, Seiichi Ono, Kodai Doi and Mitsuhiro Hasebe
625-629 :
Effect of Oxygen on Surface Tension of Liquid Ag-Sn Alloys
Joonho Lee, Toshihiro Tanaka, Masaya Yamamoto and Shigeta Hara
630-636 :
Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging
S. Vaynman, G. Ghosh and M. E. Fine
637-645 :
Thermodynamic Calculations of Phase Equilibria, Surface Tension and Viscosity in the In-Ag-X (X=Bi, Sb) System
Xing Jun Liu, Tokuro Yamaki, Ikuo Ohnuma, Ryosuke Kainuma and Kiyohito Ishida
646-651 :
Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate
Yoshikazu Takaku, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma and Kiyohito Ishida
652-660 :
Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system
Zbigniew Moser, W{\ladys{\l}aw Gçsior}, Janusz Pstru´s, Satoru Ishihara, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma and Kiyohito Ishida
661-665 :
Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
Sinn-wen Chen, Shih-kang Lin and Jui-meng Jao
666-672 :
Vibration Fracture Behavior of Sn-Bi Solder Alloys with Various Bi Contents
Jenn-Ming Song, Yea-Luen Chang, Truan-Sheng Lui and Li-Hui Chen
673-680 :
Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition
Shinichi Terashima, Yoshiharu Kariya and Masamoto Tanaka
681-688 :
Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects
Shinichi Terashima and Masamoto Tanaka
689-694 :
Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects
Yoshiharu Kariya, Takuya Hosoi, Takashi Kimura, Shinichi Terashima and Masamoto Tanaka
695-702 :
The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
Sung K. Kang, Paul Lauro, Da-Yuan. Shih, Donald W. Henderson, Jay Bartelo, Timothy Gosselin, Steve R. Cain, Charles Goldsmith, Karl Puttlitz, Tae K. Hwang and Won K. Choi
703-709 :
Novel Ultrasonic Soldering Technique for Lead-Free Solders
Keitaro Kago, Kenichiro Suetsugu, Shunji Hibino, Takashi Ikari, Akio Furusawa, Hiroaki Takano, Toshihisa Horiuchi, Kenji Ishida, Takuma Sakaguchi, Shiomi Kikuchi and Kazumi Matsushige
710-713 :
Abnormal Grain Growth of Ni3Sn4 at Sn-3.5Ag/Ni Interface
Jong Hoon Kim, Sang Won Jeong and Hyuck Mo Lee
714-720 :
Effect of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42Ni
Chi-Won Hwang and Katsuaki Suganuma
721-726 :
Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
Kyung-Seob Kim, Jun-Mo Yang, Chong-Hee Yu and Hyo-Joeng Jeon
727-733 :
IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
Jeong-Won Yoon, Sang-Won Kim and Seung-Boo Jung
734-740 :
Influence of the Interfacial Reaction Layer on Reliability of CSP Joints Using Sn-8Zn-3Bi Solder and Ni/Au Plating
Yousuke Sogo, Takashi Hojo, Hiroaki Iwanishi, Akio Hirose, Kojiro F. Kobayashi, Atsushi Yamaguch, Akio Furusawa and Kazuto Nishida
741-746 :
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Hiroshi Nishikawa, Tadashi Takemoto, Kouichi Kifune, Takashi Uetani and Norihisa Sekimori
747-753 :
Influence of Noble Metal Coating on Wettability of Copper Substrate by Sn-Ag Eutectic Solder
Hisaaki Takao and Hideo Hasegawa
754-758 :
Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls
Ikuo Shohji, Yuji Shiratori, Hiroshi Yoshida, Masahiko Mizukami and Akira Ichida
759-764 :
Application of Thermal Latent Carboxylic Acid Derivatives to Pb-Free Microsoldering
Shun Saito, Katumi Nakasato, Yukihiro Katoh, Yoshihiro Oshibe and Masahiro Ishidoya
765-775 :
Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys
Paul Vianco, Jerome Rejent and Richard Grant
776-782 :
Microstructures, Thermal and Tensile Properties of Sn-Zn-Ga Alloys
Jenn-Ming Song, Nai-Shuo Liu and Kwang-Lung Lin
783-789 :
Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy
Jaesik Lee, Woongho Bang, Jaepil Jung and Kyuhwan Oh
790-792 :
Eutectic Alloys in the Sn-Zn-Mg-Al System with Eutectic Temperature of 454 K
Masanori Inada and Masaki Kibe
793-798 :
The Effect of Reduction Capability of Resin Material on the Solder Wettability for Electrically Conductive Adhesives (ECAs) Assembly
Jong-Min Kim, Kiyokazu Yasuda, Masahiro Yasuda and Kozo Fujimoto
799-805 :
Formation of a Self-Interconnected Joint using a Low-Melting-Point Alloy Adhesive
Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda and Kozo Fujimoto
806-811 :
TiO2 Nanoparticle Suspension Preparation Using Ultrasonic Vibration-Assisted Arc-Submerged Nanoparticle Synthesis System (ASNSS)
Ho Chang, Tsing-Tshih Tsung, Liang-Chia Chen, Yi-Cheng Yang, Hong-Ming Lin, Lee-Long Han and Chung-Kwei Lin
812-817 :
Giant Magnetoimpedance in (Co0.85Fe0.06Nb0.02Ni0.07)75Si10B15 Amorphous Ribbon
Jifan Hu, Hongwei Qin, Tao Han and Juan Chen
818-823 :
Morphological Evolution of Grain-Boundary SiO2 in Internally Oxidized Cu-Si Bicrystals
Hisashi Sato, Ibuki Ota, Toshiyuki Fujii, Susumu Onaka and Masaharu Kato
824-832 :
Flat Cavities formed in TZP caused by Superplastic Deformations at High Strain-Rates and Their Effect on Elongation
Stefanus Harjo, Jan Šcaroun, Yoshinobu Motohashi, Naoki Kojima, Vasyl Ryukthin, Pavel Strunz, Matthias Baron and Rudolf Loidl
833-838 :
Computer Simulation of Formation Energy and Migration Energy of Vacancies under High Strain in Cu
Koichi Sato, Toshimasa Yoshiie, Yuhki Satoh and Qiu Xu
839-843 :
Notch Size Effects in the Fatigue Characteristics of Al-Si-Cu-Mg Cast Alloy
Yusaku Maruno, Hirofumi Miyahara, Hiroshi Noguchi and Keisaku Ogi
844-849 :
Evaporation of Phosphorus in Molten Silicon by an Electron Beam Irradiation Method
Kazuhiro Hanazawa, Noriyoshi Yuge and Yoshiei Kato
850-857 :
Removal of Metal Impurities in Molten Silicon by Directional Solidification with Electron Beam Heating
Noriyoshi Yuge, Kazuhiro Hanazawa and Yoshiei Kato
858-864 :
Boron Removal in Molten Silicon by a Steam-Added Plasma Melting Method
Naomichi Nakamura, Hiroyuki Baba, Yasuhiko Sakaguchi and Yoshiei Kato
865-869 :
Beneficial Effect of Sulfur State on High-Temperature Steam Oxidation Resistance in High Chromium Ferritic Steels
Masaaki Nakai, Yoshinori Murata, Masahiko Morinaga and Yasutoshi Sasaki
870-876 :
Filament and Droplets Formed Behind a Solid Sphere Rising Across a Liquid-Liquid Interface
Momoko Abe and Manabu Iguchi
877-879 :
Agglomeration of Copper Thin Film in Cu/Ta/Si Structure
Joon Woo Bae, Jae-Won Lim, Kouji Mimura and Minoru Isshiki
880-887 :
Effect of Heat Treatment on Microstructure and Properties of Semi-solid Chromium Cast Iron
Nuchthana Poolthong, Hiroyuki Nomura and Mitsuharu Takita
888-892 :
Effect of Al on Bulk Amorphization and Magnetic Properties of FeSnPSiB Alloys
Chih-Yuan Lin, Tsung-Shune Chin, Chih-Kang Chao, Siao-Xion Zhou, Zhih-Chao Lu, Li Wang, Fei-Fei Chen, Ming-Xiang Pan and Wei-Hua Wang
893-899 :
Simulation of Droplet Ejection for a Piezoelectric Inkjet Printing Device
Hsuan-Chung Wu, Huey-Jiuan Lin, Yung-Chi Kuo and Weng-Sing Hwang
900-903 :
Preparation of IrO2 Thin Films by Oxidating Laser-ablated Ir
Yuxue Liu, Hiroshi Masumoto and Takashi Goto
904-909 :
Effect of Mg on the Sintering of Al-Mg Alloy Powders by Pulse Electric-Current Sintering Process
Guoqiang Xie, Osamu Ohashi, Takahiro Sato, Norio Yamaguchi, Minghui Song, Kazutaka Mitsuishi and Kazuo Furuya
910-917 :
An Air Cavity Formed Behind a Poorly Wetted Sphere Penetrating into a Water Bath
Nao Shimamoto, Manabu Iguchi, Tomomasa Uemura and Noriyoshi Yonehara
918-924 :
Crystallographic Anisotropy Control of n-type Bi-Te-Se Thermoelectric Materials via Bulk Mechanical Alloying and Shear Extrusion
Sang Seok Kim and Tatsuhiko Aizawa
925-929 :
Determination of Trace Elements in High-Purity Molybdenum by Solid-Phase Extraction/ICP-MS
Shin-ichi Hasegawa, Hitoshi Yamaguchi, Katsura Yamada and Takeshi Kobayashi
930-935 :
Shape Memory Effect and Crystallographic Investigation in VN Containing Fe-Mn-Si-Cr Alloys
Susan Farjami, Kenji Hiraga and Hiroshi Kubo
936-941 :
Fracture Toughness of JLF-1 by Miniaturized 3-Point Bend Specimens with 3.3--7.0 mm Thickness
Hiroaki Kurishita, Takuya Yamamoto, Takuya Nagasaka, Arata Nishimura, Takeo Muroga and Shiro Jitsukawa
942-946 :
Improvement of the Surface Layer of Steel Using Microwave Plasma Nitriding
Khyoupin Khoo, Manabu Takeuchi, Jin Onuki and Takao Komiyama
947-952 :
Adherence of Porcelain Veneered on Titanium with an Intermediate Plasma-Sprayed Zirconia Layer
Tsung-Nan Lo, Edward Chang and Truan-Sheng Lui
953-957 :
Electron-Phonon Mechanism of ømega Phase Transformation
Jianfeng Wan, Xiaolin Lei, Shipu Chen and Zuyao Xu (T. Y. Hsu)
958-963 :
Effect of ECAP Strain on Deformation Behavior at Low Temperature Superplastic Regime of Ultrafine Grained 5083 Al Alloy Fabricated by ECAP
Kyung-Tae Park, Hang-Jae Lee, Chong Soo Lee, Byung Du Ahn, Hyun Soo Cho and Dong Hyuk Shin
964-967 :
Synthesis of Au/TiO2 Core-shell Structure Nanoparticles and the Crystallinity of TiO2 Shell
Yeon-tae Yu and Paul Mulvaney
968-971 :
Influence of Sulfate Ions on Conversion of Fe(OH)3 Gel to β-FeOOH and α-Fe2O3
Kiyoshi Kanie, Atsushi Muramatsu, Shigeru Suzuki and Yoshio Waseda
972-975 :
Fractal Characteristics of the Solidification Process
Maricel Agop, Pavlos Ioannou, Petru Nica, Cristina Radu, Adrian Alexandru and Petre Vizureanu

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