Materials Transactions Online

Materials Transactions, Vol.42 No.5 (2001)

722-731 :
Thermodynamic Analysis of the Sn-Ag-Bi Ternary Phase Diagram
Hiroshi Ohtani, Isamu Satoh, Masamitsu Miyashita and Kiyohito Ishida
732-738 :
Activity Measurement of the Constituents in Molten Ag-In-Sn Ternary Alloy by Mass Spectrometry
Takahiro Miki, Naotaka Ogawa, Tetsuya Nagasaka and Mitsutaka Hino
739-744 :
Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder
Seok-Hwan Huh, Keun-Soo Kim and Katsuaki Suganuma
745-750 :
Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test
Tadashi Takemoto and Makoto Miyazaki
751-755 :
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
Chang-Bae Lee, Seung-Boo Jung, Young-Eui Shin and Chang-Chae Shur
756-760 :
Effect of Cu in Pb Free Solder Ball on the Microstructure of BGA Joints with Au/Ni Coated Cu Pads
Keisuke Uenishi, Toshio Saeki, Yasuhiro Kohara, Kojiro F. Kobayashi, Ikuo Shoji, Masataka Nishiura and Masaharu Yamamoto
761-768 :
Effect of Cooling Rate on Microstructure and Strength Properties of Tin-Silver-Copper Solder Ball Bonding
Kunihiro Noguchi, Mayumi Ikeda, Isao Shimizu, Yoshito Kawamura and Yasuhide Ohno
769-775 :
Aging Behavior of a Sn-Bi Eutectic Solder at Temperatures between 233 and 373 K
Jia Ning Hu, Hiroyuki Tanaka and Toshio Narita
776-782 :
Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys
Yasuyuki Miyazawa and Tadashi Ariga
783-789 :
Effect of In Addition on Sn-3.5Ag Solder and Joint with Cu Substrate
Won Kyoung Choi, Seung Wook Yoon and Hyuck Mo Lee
790-793 :
Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders
Ikuo Shohji, Fuminari Mori and Kojiro F. Kobayashi
794-802 :
Influence of Interfacial Reaction on Reliability of QFP Joints with Sn-Ag Based Pb Free Solders
Akio Hirose, Toshio Fujii, Takeshi Imamura and Kojiro F. Kobayashi
803-808 :
Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps
Shinichi Terashima, Tomohiro Uno, Eiji Hashino and Kohei Tatsumi
809-813 :
Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
Young-Eui Shin, Kyung-Woo Lee, Kyong-Ho Chang, Seung-Boo Jung and Jae Pil Jung
814-819 :
Microstructure and Mechanical Properties of Partial Melted Joint Using off Eutectic Lead-Free Solders
Jun Seok Ha, Choon Sik Kang, Jae Yong Park and Jae Pil Jung
820-824 :
A Study on the Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5 mass%Ag and Sn-37 mass%Pb Solder
Chang-Bae Park, Soon-Min Hong, Jae-Pil Jung, Choon-Sik Kang and Yong-Eui Shin
825-828 :
Endurance Test of Oxidation-resistant CVD-SiC Coating on C/C Composites for Space Vehicle
Takahiro Sekigawa, Kazuyuki Oguri, Jiro Kochiyama and Kazuyuki Miho
829-832 :
Effective Pair Potentials of Molten AgBr Estimated from Experimental Partial Structure Factors
Pavlin Dakev Mitev, Masatoshi Saito and Yoshio Waseda
833-837 :
Characteristics of HVOF-Sprayed WC-Co Cermet Coatings Affected by WC Particle Size and Fuel/Oxygen Ratio
Byoung Hee Kim and Dong Soo Suhr
838-841 :
Synthesis of Vapor-Grown Carbon Fibers Using Nanocrystalline Fe75Si15B10 Alloy as a Catalyst
Ken Unno, Hidehiro Kudo, Atsunori Kamegawa, Hitoshi Takamura, Masuo Okada, Reijiro Takahashi and Junichiro Yagi
842-849 :
Superplastic Deformation of Continuous Fiber Reinforced Titanium Matrix Composites
Takeshi Yamada, Takayuki Tsuzuku and Hiroaki Sato
850-855 :
Semi-continuous Production of Niobium Powder by Magnesiothermic Reduction of Nb2O5
Il Park, Toru H. Okabe, Yoshio Waseda, Hyo Shin Yu and Oh Yeon Lee
856-861 :
Catalycity Measurement of Oxidation-resistant CVD-SiC Coating on C/C Composite for Space Vehicle
Kazuyuki Oguri, Takahiro Sekigawa, Jiro Kochiyama and Kazuyuki Miho
862-869 :
Influence of Copper Addition to α-Fe2Si5 on Thermoelectric Properties of Iron-Silicides Produced by Spark-Plasma Sintering
Kiyoshi Nogi and Takuji Kita
870-875 :
Characteristics of HVOF-Sprayed Cr3C2 (20 mass%NiCr) Coatings Part 2: Effect of Heat Treatment of the Coatings
Byoung Hee Kim and Dong Soo Suhr
876-880 :
Rotating-Beam Fatigue Properties of Pd40Cu30Ni10P20 Bulk Glassy Alloy
Yoshihiko Yokoyama, Nobuyuki Nishiyama, Kenzo Fukaura, Hisakichi Sunada, Yoshihiro Murakami and Akihisa Inoue
881-885 :
Electrical Resistance in Fe/Al2O3 Multilayered Films Prepared by an Electron Beam Evaporation Method* (Electrical Resistance in Fe/Al2O3 Oblique Deposition Multilayers)
Wataru Takakura, Shoji Ikeda and Yuji Ueda
886-889 :
Formation and Mechanical Properties of Bulk Glassy Ni57-xTi23Zr15Si5Pdx Alloys
Limin Wang, Chunfei Li and Akihisa Inoue
890-893 :
Reliability Enhancement of Solder Joints Made by a Void Free Soldering Process
Jin Onuki, Yasunori Chonan, Takao Komiyama, Masayasu Nihei, Masateru Suwa and Makoto Kitano
894-896 :
The Structure of an Al-Ni-Fe Decagonal Quasicrystal Studied by High-Angle Annular Detector Dark-Field Scanning Transmission Electron Microscopy
Kenji Hiraga and Tetsu Ohsuna
897-900 :
The Structure of an Al-Co-Ni Crystalline Approximant with an Ordered Arrangement of Atomic Clusters with Pentagonal Symmetry
Kenji Hiraga, Tetsu Ohsuna, Kunio Yubuta and Sinya Nishimura

[JIM HOME] [JOURNAL ARCHIVES]

© 2001 The Japan Institute of Metals
Comments to us : editjt@jim.or.jp